Ticker: BIDU, Company: Baidu, Inc., Type: 6-K, Date: 2018-12-04
Original SEC Filing: Click here

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Webplus: BIDU/20181204/6-K/2_EX-1.1/000.htm SEC Original: d666483dex11.htm
BAIDU, INC. $[●] 4.375% Notes due 2024 to be consolidated and form a single series with the US$600,000,000 4.375% Notes due 2024 issued on November 14, 2018 Underwriting Agreement [●], 2018 Goldman Sachs (Asia) L.L.C. 68/F, Cheung Kong Center 2 Queen’s Road Central Hong Kong J.P. Morgan Securities LLC 383 Madison Avenue New York, New York 10179 As Representatives of

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Webplus: BIDU/20181204/6-K/1/000.htm SEC Original: d666483d6k.htm
EXPLANATORY NOTE 6-K F-3 333-218972) BAIDU, INC. Herman Yu Chief Financial Officer Description 1.1 Form of Underwriting Agreement 6-K 1 d666483d6k.htm FORM 6-K

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Company Info:

Ticker: BIDU, Company: Baidu, Inc., Type: 6-K, Date: 2018-12-04CIK: 0001329099, Location: F4, SIC: 7370, SIC Desc: SERVICES-COMPUTER PROGRAMMING, DATA PROCESSING, ETC.
Business Phone & Address:
BAIDU CAMPUS, NO. 10 SHANGDI 10TH STREET, HAIDIAN DISTRICT
BEIJING 100085