SEMICONDUCTORS and RELATED DEVICES – Page 742

HIMX [Himax Technologies] 6-K: (Original Filing)

[44,173,484 Ordinary Shares HIMAX TECHNOLOGIES, INC. ORDINARY SHARES, PAR VALUE US$0.30 PER SHARE in the form of American Depositary Shares UNDERWRITING AGREEMENT , 2013 , 2013 Citigroup Global Markets Inc. 388 Greenwich Street New York, New York 10013 Merrill Lynch, Pierce, Fenner & Smith Incorporated One Bryant Park New York, New York 10036 Chardan Capital Markets, LLC 17 State Street] [Description of Document 1.1 Form of Underwriting Agreement. 2]

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UMC [UNITED MICROELECTRONICS] 6-K: (Original Filing)

[Description 99.1 Announcement on 2013/06/13: UMC joins IBM chip alliance for 10nm process development 1 UMC joins IBM chip alliance for 10nm process development 1.Date of occurrence of the event:2013/06/13 In accordance with the agreement. 7.Effect on company finances and business (not applicable where rescinded): Improving company finances and business. 8.Concrete purpose/objective (not applicable where rescinded): UMC joins IBM chip] [FORM 6-K June 13, 2013 United Microelectronics Corporation No. 3 Li Hsin Road II x x n/a United Microelectronics Corporation Chitung Liu Chitung Liu CFO Description 99 6K on 2013/06/13 6-K 1 htm_7763.htm LIVE FILING]

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HIMX [Himax Technologies] 6-K: 44,173,484 Ordinary Shares HIMAX TECHNOLOGIES, INC. ORDINARY SHARES,

[44,173,484 Ordinary Shares HIMAX TECHNOLOGIES, INC. ORDINARY SHARES, PAR VALUE US$0.30 PER SHARE in the form of American Depositary Shares UNDERWRITING AGREEMENT , 2013 , 2013 Citigroup Global Markets Inc. 388 Greenwich Street New York, New York 10013 Merrill Lynch, Pierce, Fenner & Smith Incorporated One Bryant Park New York, New York 10036 Chardan Capital Markets, LLC 17 State Street] [Description of Document 1.1 Form of Underwriting Agreement. 2]

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UMC [UNITED MICROELECTRONICS] 6-K: Description 99.1 Announcement on 2013/06/13: UMC joins IBM

[Description 99.1 Announcement on 2013/06/13: UMC joins IBM chip alliance for 10nm process development 1 UMC joins IBM chip alliance for 10nm process development 1.Date of occurrence of the event:2013/06/13 In accordance with the agreement. 7.Effect on company finances and business (not applicable where rescinded): Improving company finances and business. 8.Concrete purpose/objective (not applicable where rescinded): UMC joins IBM chip] [FORM 6-K June 13, 2013 United Microelectronics Corporation No. 3 Li Hsin Road II x x n/a United Microelectronics Corporation Chitung Liu Chitung Liu CFO Description 99 6K on 2013/06/13 6-K 1 htm_7763.htm LIVE FILING]

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UMC [UNITED MICROELECTRONICS] 6-K: (Original Filing)

[FORM 6-K June 13, 2013 United Microelectronics Corporation No. 3 Li Hsin Road II x x n/a United Microelectronics Corporation Chitung Liu Chitung Liu CFO 6-K 1 htm_7762.htm LIVE FILING]

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UMC [UNITED MICROELECTRONICS] 6-K: FORM 6-K June 13, 2013 United Microelectronics Corporation

[FORM 6-K June 13, 2013 United Microelectronics Corporation No. 3 Li Hsin Road II x x n/a United Microelectronics Corporation Chitung Liu Chitung Liu CFO 6-K 1 htm_7762.htm LIVE FILING]

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UMC [UNITED MICROELECTRONICS] 6-K: (Original Filing)

[FORM 6-K June 13, 2013 United Microelectronics Corporation No. 3 Li Hsin Road II x x n/a United Microelectronics Corporation Chitung Liu Chitung Liu CFO 6-K 1 htm_7761.htm LIVE FILING]

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TSM [TAIWAN SEMICONDUCTOR MANUFACTURING CO] 6-K: (Original Filing)

[Taiwan Semiconductor Manufacturing Company Ltd. By Lora Ho Senior Vice President & Chief Financial Officer TSMC Shareholders Approve NT$3.0 Cash Dividend Hsinchu, Taiwan, R.O.C. June 11, 2013 1.]

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TSM [TAIWAN SEMICONDUCTOR MANUFACTURING CO] 6-K: Taiwan Semiconductor Manufacturing Company Ltd. By Lora Ho

[Taiwan Semiconductor Manufacturing Company Ltd. By Lora Ho Senior Vice President & Chief Financial Officer TSMC Shareholders Approve NT$3.0 Cash Dividend Hsinchu, Taiwan, R.O.C. June 11, 2013 1.]

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CSIQ [Canadian Solar] 6-K: (Original Filing)

[Canadian Solar Signs C$310 Million EPC Agreement for GUELPH, Ontario, June 10, 2013 Canadian Solar Inc. (NASDAQ: CSIQ) (the Company, or Canadian Solar), one of the worlds largest solar power companies, today announced that its subsidiary, Canadian Solar Solutions Inc., has entered into an Engineering, Procurement, and Construction (EPC) agreement with Grand Renewable Solar LP, a solar energy project] [FORM 6-K CANADIAN SOLAR INC. No. 199 Lushan Road Suzhou New District Suzhou, Jiangsu 215129 Peoples Republic of China Form 20-F x Form 40-F o o o CANADIAN SOLAR INC. Form 6-K TABLE OF CONTENTS]

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