[September 29, 2014 VIA EDGAR AND E-MAIL Mr. Stephen Krikorian, Accounting Branch Chief Re: Qihoo 360 Technology Co. Ltd. Form 20-F for the Fiscal Year ended December 31, 2013 Filed April 25, 2014 File No. 001-35109 Dear Mr. Krikorian and Mr. Rohn, This letter sets forth our responses to the comments contained in the letter dated September 5, 2014 from]
[September 29, 2014 VIA EDGAR AND E-MAIL Mr. Stephen Krikorian, Accounting Branch Chief Re: Qihoo 360 Technology Co. Ltd. Form 20-F for the Fiscal Year ended December 31, 2013 Filed April 25, 2014 File No. 001-35109 Dear Mr. Krikorian and Mr. Rohn, This letter sets forth our responses to the comments contained in the letter dated September 5, 2014 from]
[Description 99.1 Announcement on 2014/08/26: To announce related materials on acquisition of machinery and equipment 99.2 Announcement on 2014/08/28: Important Resolutions from 12th term 19th Board Meeting 99.3 Announcement on 2014/08/28: To announce related materials on acquisition of the common shares of a new company jointly established with Fujitsu Semiconductor Limited 99.4 Announcement on 2014/08/29: UMC and Fujitsu Semiconductor Limited] [FORM 6-K September 29, 2014 United Microelectronics Corporation No. 3 Li Hsin Road II x x n/a United Microelectronics Corporation Chitung Liu Chitung Liu CFO Description 99 6K on 09/29/2014 6-K 1 htm_8882.htm LIVE FILING]
[SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION PROPOSED ISSUE OF US$500 MILLION 4.125% BONDS DUE 2019 Joint Lead Managers PROPOSED ISSUE OF BONDS Completion of the Bond Subscription Agreement is subject to the satisfaction or waiver of the conditions precedent therein and is expected to take place on 7 October 2014. In addition, the Bond Subscription Agreement may be terminated in certain circumstances.] [FORM 6-K Semiconductor Manufacturing International Corporation 18 Zhangjiang Road x x n/a Semiconductor Manufacturing International Corporation Dr. Tzu-Yin Chiu Dr. Tzu-Yin Chiu Chief Executive Officer and Executive Director Description 99.1 Announcement dated 25 September 2014 “PROPOSED ISSUE OF US$500 MILLION 4.125% BONDS DUE 2019" 6-K 1 htm_8885.htm LIVE FILING]
